SEOUL (Reuters) – The world’s second-largest memory chipmaker SK Hynix said on Thursday it began mass production of a 12-layer version of the latest generation of high-bandwidth memory (HBM) chips, to meet demand from the current AI boom.
The Nvidia supplier said in a statement it was the world’s first latest-generation HBM product, called HBM3E, with 12-layers and the largest capacity of existing HBM to date at 36 gigabytes.
(Reporting by Joyce Lee; Editing by Jacqueline Wong)
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